In this report, the Global 3D IC & 2.5D IC Packaging Competitive Market Share & Forecast 2019 market is valued at USD XX million in 2017 and is expected to reach USD XX million by the end of 2025, growing at a CAGR of XX% between 2017 and 2025. Global 3D IC & 2.5D IC Packaging Competitive Market Share & Forecast 2019 market has been broken down by major regions, with complete market estimates on the basis of products/applications on a regional basis.

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2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.

3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).

Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.

The global 3D IC & 2.5D IC Packaging market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.

This report focuses on 3D IC & 2.5D IC Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D IC & 2.5D IC Packaging market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.

At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:

Intel Corporation

Toshiba Corp

Samsung Electronics

Stmicroelectronics

Taiwan Semiconductor Manufacturing

Amkor Technology

United Microelectronics

Broadcom

ASE Group

Pure Storage

Advanced Semiconductor Engineering

Segment by Regions

North America

Europe

China

Japan

Segment by Type

3D TSV

2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

Segment by Application

Automotive

Consumer electronics

Medical devices

Military & aerospace

Telecommunication

Industrial sector and smart technologies

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